MEMS Optical - Foundry Services

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MEMS Optical has recently completed a 12 million dollar expansion of it's facility to better offer a complete line of foundry services. These services are shown below and, along with our engineering expertise, set us apart as a top quality service provider. Our Clean Room facilities have the following capabilities:

Photolithography

Contact and Projection lithography
Front to back alignment capability
Automated photoresist spinning cluster (2-sided)
1um minimum feature size
Wafer sizes: 2"-6", 0.2mm to 6mm thickness

Bonding

Silicon fusion bonding, 4" wafers

Plasma Etching

RIE, ICP and DRIE plasmas
Silicon, fused silica, quartz, GaP, Ge, ZnSe
Wafer sizes: 2"-6"

Wet Etching

KOH for silicon
All standard wet etches and cleans

Polishing/Grinding

Backgrinding for silicon 4-6" wafers
CMP for silicon 4" wafers

Thin Films

Thermal oxide, 2-6" wafers
LPCVD Si3N4, SiGe, Ge, polysilicon
Evaporated and sputtered metals

Metrology

Non-contact film thickness measurement
AFM
Profilometers
Monochromatic and white light interferometers
Optical microscopes

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